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With the rapid development of 5G communications, new energy vehicles, energy storage systems, and high-power electronic devices, the importance of heat dissipation materials is becoming increasingly prominent. As one of the most widely used interface materials in the field of electronic thermal management, silicone thermal pads are widely used between power devices, PCBs, and heat sinks due to their excellent Thermal Conductivity, electrical insulation, and assembly friendliness. However, the performance degradation and lifespan ofsilicone thermal pads during long-term service are gradually becoming a focus of industry attention.

The lifespan of silicone thermal pads is not determined by a single factor, but is the result of the combined effects of multiple factors, including the Material System, mechanical stress, and environmental conditions.

Material system: The fundamental factor determining lifespan

Silicone thermal pads are typically made by compounding silicone matrix and thermal conductive fillers. The stability of silicone molecular chains, crosslinking density, as well as the type and uniformity of filler distribution, all directly affect the material’s long-term high-temperature resistance and mechanical strength.

If the heat resistance of the silicone base itself is insufficient, it is prone to aging, hardening or even cracking under continuous high temperatures, which will lead to a decline in thermal conductivity. Although increasing the amount of filler can enhance the thermal conductivity, an excessive amount will make the material brittle and reduce its elasticity, which may accelerate the fatigue damage of the material. Therefore, how to balance the proportion of each component in the material formula is the key to ensuring the long-term reliable operation of the thermal pad.

Mechanical Stress: A Hidden Killer During Long-Term Service

In practical applications, silicone thermal pads are often under continuous compression to fill the microscopic gaps between devices and heat dissipation structures. The stress generated by prolonged pressure and repeated thermal expansion and contraction can lead to compression set in the material.

Once the thermal pad‘s resilience decreases, the contact interface gap widens, and thermal resistance increases. This not only weakens heat dissipation but can also cause localized overheating, further accelerating material aging and creating a vicious cycle.

Environmental Factors: A Key Variable Accelerating Aging

Environmental conditions are equally important. High temperature, high humidity, strong ultraviolet radiation, and exposure to chemical media can all affect the molecular structure of silicone thermal pads to varying degrees. For example, in high humidity environments, some low-quality silicone materials may experience moisture absorption and swelling, or a decrease in interfacial adhesion; under conditions of high temperature and oxygen, oxidation reactions will accelerate the material aging process.

Furthermore, the frequent thermal shocks encountered in new energy and outdoor applications can significantly shorten the reliable lifespan of thermal pads.

Synergistic effect: Multiple factors increase the risk of failure

It is important to note that the materials, stress, and environment do not act independently. High-temperature environments accelerate the aging of materials, making them more prone to permanent deformation under mechanical stress; while stress concentration amplifies the destructive effect of environmental factors on the material structure. The synergistic effect of these multiple factors is the fundamental reason for the premature failure of silicone heat dissipation pads under complex operating conditions.

Conclusion

CMAI suggest that when selecting silicone thermal pads, companies should not only focus on the initial thermal conductivity, but also comprehensively evaluate the material’s aging resistance, compression rebound characteristics, and the operating conditions of the target application environment. Furthermore, by implementing reasonable structural design, controlling the compression ratio, and improving the operating environment, the service life of thermal pads can also be effectively extended.

With electronic devices continuously evolving towards higher power and higher integration, in-depth research into the mechanisms affecting the lifespan of silicone thermal pads will become an important direction for promoting the technological upgrading of thermal management materials.

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Company Name: Shenzhen Changmai Technology Co., Ltd.
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